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Processing and Packaging

We provides customers with comprehensive packaging solutions, including SOP, QFN, and SOT. We support the development of products with special shapes or assembly requirements to meet diverse and customized customer needs. We help you reduce system costs, simplify designs, and minimize dimensions.

Ultra-thin dual-lead package

Thin small - 2 Leads Package

Back-mounted magnetic assembly

Integration magnetism Package

Ultra-thin triple-lead package

Thin small - 3 Leads Package

Ultra-thin triple-lead package

Thin small - 3 Leads Package

TO-92S-A1Wide-body short-lead package

TO-92S-A2Wide-body long-lead package

TO-92S-B1Narrow-body short-lead package

TO-92S-B2Narrow-body long-lead package

TO-94Four-lead through-hole package

Small external crystal transistor

Small Outline Transistor

SOT23Narrow-body small package

SOT23-3Wide-body small package

SOT89-389 Series 3-pin package

Ultra-thin triple-lead package

Thin small - 3 Leads Package

SOP1414-pin small outline package

SOP1616-pin small outline package

SOP-2828-pin small outline package

SOP-88-pin small outline package

(021)6408 0230*803