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Company Introduction

Vision

To become a leading automotive IC supplier in China, highly recognized by OEMs in the automotive industry

Mission

Through technological innovation and cost innovation
Continuously creating maximum value for customers

Value

Integrity and openness
Collaboration and Innovation

Semiment Technology Co., Ltd.

Founded in 2011, Semiment Technology Co., Ltd. is headquartered in Shanghai, with R&D centers, sales centers and automotive-grade testing/packaging factories in Shanghai, Hangzhou, Xi'an, Shenzhen, Jiashan and other places. As one of the earliest integrated circuit (IC) design companies for automotive electronics in China, Semiment is committed to providing customers with complete automotive-grade IC solutions. Its main products include sensor ICs, power management ICs, motor driver ICs, and other ICs, which are widely used in the fields of automotive electronics, consumer electronics, and industrial control, etc.

Zhejiang Semiyung Electronics Technology Co., Ltd.

Established in January 2022 by Semiment Technology, Zhejiang Semiyung Electronics Technology Co., Ltd. operates an automotive-grade packaging and testing center. Located in the China-Singapore Industrial Park, Jiashan, Zhejiang, it specializes in semiconductor IC packaging, testing, and wafer testing services.
占地38.4亩

Site area: 38.4 mu (approx. 2.55 acres)

建筑面积4.5万平米

Building area: 45,000 square meters

先进厂房和设备

Advanced facilities and equipment

Corporate layout

Xi'an

Xi'an R&D:12F, Tower B, Huajing Business Plaza,
20 Fenghui South Road, High-Tech Zone

Jiashan

Jiashan:Packaging Plant—Zhejiang Saiyang Electronic Technology Co., Ltd.

Shanghai

Shanghai Headquarters:5F, Building 1, Xinglian Research Building,
1535 Hongmei Road, Xuhui District

Shenzhen

Shenzhen Sales:Room 4008, Tower A, Zhongguan Times Plaza,
4168 Liuxian Avenue, Nanshan District

Hangzhou

Hangzhou:Room 407, Block B, Building 1, 459 Jianghong Road,
Changhe Subdistrict, Binjiang District

Development History

2024

2023

2022

2021

2020

2019

2018

2017

2016

2014

2011

2024

Automotive-grade packaging plant officially launched

ABS wheel speed sensor shipments

exceeded 100 million units

Multiple products achieved

annual sales exceeding 10 million units

in the automotive industry

2023

Company obtained ISO 26262 certification

Multiple chips achieved ISO 26262 certification

Annual shipments exceed 600 million units

Establishment of automotive-grade packaging facility

2022

Company achieves ISO 26262 certification

Multiple chips achieved ISO 26262 certification

Annual shipments exceed 600 million units

Establishment of automotive-grade packaging facility

2021

Automotive-grade products

Annual sales exceeded 100 million yuan

Cumulative shipments

Surpassed 1 billion units

2020

Automotive-grade products

Annual sales exceeded 100 million yuan

Cumulative shipments

Surpassed 1 billion units

2019

Products first entered the automotive-grade market

Programmable linear series products

Integrated into core automotive components

ABS wheel speed sensor products

Shipments exceeded 10 million units

2018

Products first entered the automotive-grade market

Programmable linear series products

integrated into core automotive components

ABS wheel speed sensor products

exceeded 10 million units shipped

2017

Products first entered the automotive-grade market

Programmable linear series products

integrated into core automotive components

ABS wheel speed sensor products

exceeded 10 million units shipped

2016

Products first entered the automotive-grade market

Programmable linear series products

integrated into core automotive components

ABS wheel speed sensor products

shipments exceeded 10 million units

2014

Initiated automotive-grade chip R&D

Sales revenue surpassed 10 million yuan

2011

Formed the team

(021)6408 0230*803